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H155HF

FEATURES

Anti-CAF Capability

Superior thermal resistance for Lead-free compatible

Lower Dk/Df

Halogen,antimony and red phosphorus free


APPLICATIONS

Memory module,Tablet,Notebook

Smart phone,Wearable smart devices


GENERAL PROPERTIES

Item

  IPC-TM-650

Test Condition

Unit

Typical value

Glass transition temp.

2.4.25

DSC

168

CTE,Z-axis

2.4.24

α1,TMA

ppm/

27

α2,TMA

ppm/

235

50~260℃,TMA

%

2.6

Decomposition Temp.

2.4.24.6

TGA

386

T288

2.4.24.1

TMA,copper clad

min

30

Thermal stress

2.4.13.1

Copper clad

sec

>120

unclad

sec

>180

Water absorption

2.6.2.1

E-1/105+D-24/23

%

0.11

Peel Strength/18μm

2.4.8

as received

lb/in

7.0

after thermal stress

lb/in

7.0

Permittivity(RC70%)

2.5.5.9

C-24/23/50,2G

/

3.49

Loss tagent(RC70%)

2.5.5.9

C-24/23/50,2G

/

0.013

Volume resistivity

2.5.17.1

C-96/35/90

MΩ·cm

5.70*109

Surface resistivity

2.5.17.1

C-96/35/90

MΩ

5.54*107

Arc Resistance

2.5.1

D48/50+D0.5/23

sec

130

Dielectric Breakdown

2.5.6

D48/50+D0.5/23

kV

60

Flexural strength

Warp

2.4.4

as received

MPa

580

Fill

2.4.4

as received

MPa

475

Flame resistance

UL-94

A&E-24/125

/

V0

CTI

C-96/20/65

IEC-60112

Rating

PLC3

 

u  Specification sheet:IPC-4101/128, for reference only.

u  Above typical value is tasted from CCL1.0mm 7628*5,except Dk/Df,the typical value is only for reference,cannot be used as the basis for judgement.


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