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H151HF

FEATURES

Excellent thermal resistance

Excellent rigidity, suitable for HDI process

Low water absorption, excellent anti-CAF, high reliability

Halogen free, compatible with lead-free process


APPLICATIONS

Memory Module, Mobile Phone, Computer

Backplane, Card Board

Server

Heavy Copper Product

Automobile Electronics


GENERAL PROPERTIES

Item

Test Condition

Unit

Spec

Typical value

Tg

DSC

≧145

153

Peel Strength (1oz THE)

288℃,10S

N/mm

1.05

1.19

Thermal stress

288℃,solder dip

S

>10

180s No delamination

Flexural Strength

Warp

N/mm2

≧415

606

Fill

≧345

485

Flammability

E 24/125

UL94V-0

V-0

Surface Resistivity

After moisture

≧1.0x104

5.21x107

Volume Resistivity

After moisture

MΩ·cm

≧1.0x106

5.10x109

Dielectric Constant(RC50%)

1 GHZ C 24/23/50

≦5.4

4.1

Loss Tangent (RC50%)

1 GHZ C 24/23/50

≦0.035

0.014

Arc Resistance

D 48/50+D 0.5/23

S

≧60

150

Dielectric Breakdown

D 48/50+D 0.5/23

kV

≧40

57

Moisture Absorption

D 24/23

%

≦0.8

0.12

Td

Weight Loss 5%

≧325

360

CTE in Z-Axis

Alpha 1

ppm

TMA

≦60

45

Alpha 2

ppm

≦300

225

50-260

%

≦4.0

2.7

T288(Unclad)

TMA

Min

≧5

>60

 

u  Specimen thickness: 1.0mm

u  Specification sheet: IPC-4101E/127,128, is for your reference only.

u  Explanation: C: Humidity conditioning

   D: Immersion conditioning distilled water.

   E: Temperature conditioning




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